Patent Assignment
Reel/Frame 019211/0691
Assignment of Assignor's Interest
Recorded: 2007-04-25
Pages: 2
Assignors
YANG, KU-FENG
Executed: 2007-04-25
WU, WENG-JIN
Executed: 2007-04-25
CHIOU, WEN-CHIH
Executed: 2007-04-25
YU, CHEN-HUA
Executed: 2007-04-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Bonding