IP Library › Assignment 019219/0979
Patent Assignment
Reel/Frame 019219/0979

Assignment of Assignor's Interest

Recorded: 2007-04-13 Pages: 2
Assignors
SHIN, SANG HYUN
Executed: 2007-03-23
CHOI, SEOG MOON
Executed: 2007-04-03
LEE, YOUNG KI
Executed: 2007-03-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Package Having Multi-Stepped Reflecting Surface Structure and Fabrication Method Thereof
Patent: 7,547,923 →
Application: 11/783,948 →
Publication: US 2007/0246715
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →