Patent Assignment
Reel/Frame 019226/0905
Assignment of Assignor's Interest
Recorded: 2007-04-23
Pages: 2
Assignors
BRUNNBAUER, MARKUS
Executed: 2007-03-01
MAHLER, JOACHIM
Executed: 2007-03-01
MENGEL, MANFRED
Executed: 2007-03-01
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, 81669, MUNICH, GERMANY
Covered Property
(1)
Semiconductor Module with a Dielectric Layer Including a Fluorocarbon Compound on a Chip
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 18, 2012
From: INFINEON TECHNOLOGIES AG
To: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
Reel/Frame 027548/0623 →
Assignment of Assignor's Interest
Jan 19, 2012
From: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 027556/0709 →
Change of Name
Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest
Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →