IP Library › Assignment 019228/0422
Patent Assignment
Reel/Frame 019228/0422

Assignment of Assignor's Interest

Recorded: 2007-04-30 Pages: 4
Assignors
CHARLES, SYLVIE S.
Executed: 2007-04-30
DANOVITCH, DAVID D.
Executed: 2007-04-27
OUIMET, SYLVAIN S.E.
Executed: 2007-04-27
SYLVESTRE, JULIEN J.
Executed: 2007-04-27
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATON
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Structure and Method for Stress Reduction in Flip Chip Microelectronic Packages Using Underfill Materials with Spatially Varying Properties
Patent: 7,498,198 →
Application: 11/742,120 →
Publication: US 2008/0265435
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028867/0216 →