Patent Assignment
Reel/Frame 019247/0998
Assignment of Assignor's Interest
Recorded: 2007-04-16
Pages: 2
Assignor
MURAKI, SHINJI
Executed: 2007-04-04
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Molding Apparatus for Manufacturing a Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.