Molding apparatus for manufacturing semiconductor device
View Patent ↗A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which has a top surface which faces the cavity and which projects from the bottom surface of the lower half toward a substantial center point of the substrate mounting plate, wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when the upper and lower halves are coupled with each other.
1. A molding apparatus, comprising:
an upper half having a substrate mounting plate; and
a lower half having a bottom surface and being coupled with the upper half to form a cavity there between so that the substrate mounting plate and the bottom surface face the cavity, the lower half including a projecting part having a top surface which faces the cavity and which projects from the bottom surface toward a substantial center point of the substrate mounting plate, the projecting part being configured by a plurality of column parts which are piled up together to form step surfaces facing the cavity so that a higher step surface has an area that is narrower than that of a lower step surface,
wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and
wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when the upper and lower halves are coupled with each other.
2. The molding apparatus according to claim 1 , wherein each of the plurality of circular column parts is circular.
3. The molding apparatus according to claim 1 , each of the plurality of column parts is rectangular.
4. A molding apparatus, comprising:
an upper half having a substrate mounting plate; and
a lower half having a bottom surface and being coupled with the upper half to form a cavity there between so that the substrate mounting plate faces the cavity, the lower half including a projecting part having a substantially spherical surface which faces the cavity and which projects from the bottom surface, and having an apex which corresponds to a substantial center point of the substrate mounting plate,
wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and
wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when said upper and lower halves are coupled with each other.