Patent Assignment
Reel/Frame 019315/0530
Assignment of Assignor's Interest
Recorded: 2007-05-18
Pages: 4
Assignors
HSU, CHAO-SHUN
Executed: 2007-03-08
TANG, CHEN-YAO
Executed: 2007-03-08
CHAO, CLINTON
Executed: 2007-03-08
PENG, MARK SHANE
Executed: 2007-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods for Forming Single Dies with Multi-Layer Interconnect Structures and Structures Formed Therefrom