Patent Assignment
Reel/Frame 019321/0825
Assignment of Assignor's Interest
Recorded: 2007-05-21
Pages: 5
Assignors
CHANG, SHIH-CHIEH
Executed: 2007-02-26
WANG, YING-LANG
Executed: 2007-02-26
CHEN, KEI-WEI
Executed: 2007-02-26
TSAO, JUNG-CHIH
Executed: 2007-02-26
WANG, YU-SHENG
Executed: 2007-02-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Via/Contact and Damascene Structures and Manufacturing Methods Thereof