Assignment of Assignor's Interest

Recorded: 2007-05-22 Pages: 4

Assignors

KIM, SARAH E.

Executed: 2003-12-17

LEE, KEVIN J.

Executed: 2003-12-17

TOWLE, STEVEN

Executed: 2003-12-18

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052

Covered Property (1)

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Application: 11/740,246 →

Publication: US 2007/0190776

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.