IP Library › Assignment 019363/0178
Patent Assignment
Reel/Frame 019363/0178

Assignment of Assignor's Interest

Recorded: 2007-05-31 Pages: 2
Assignors
CHEN, CHEN-SHIEN
Executed: 2007-05-25
CHING, KAI-MING
Executed: 2007-05-25
CHEN, CHIH-HUA
Executed: 2007-05-25
KUO, CHEN-CHENG
Executed: 2007-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Multi-Die Wafer Level Packaging
Patent: 7,514,797 →
Application: 11/756,347 →
Publication: US 2008/0296763
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →