Patent Assignment
Reel/Frame 019372/0815
Assignment of Assignor's Interest
Recorded: 2007-06-01
Pages: 3
Assignor
FAB SOLUTIONS, INC.
Executed: 2007-05-21
Assignee
TOPCON CORPORATION
75-1 HASUNUMA-CHO, ITABASHI-KU, TOKYO, 174-8580, JAPAN
Covered Properties
(5)
Production Managing System of Semiconductor Device
Surface Contamination Analyzer for Semiconductor Wafers, Method Used Therein and Process for Fabricating Semiconductor Device
Contact Hole Standard Test Device, Method of Forming the Same, Method of Testing Contact Hole, Method and Apparatus for Measuring a Thickness of a Film, and Method of Testing a Wafer
Semiconductor Device Tester
Semiconductor Device Test Method and Semiconductor Device Tester