IP Library › Assignment 019378/0606
Patent Assignment
Reel/Frame 019378/0606

Assignment of Assignor's Interest

Recorded: 2007-06-05 Pages: 2
Assignors
HAO, JI YUAN
Executed: 2007-05-10
ONG, SEE YAP
Executed: 2007-05-10
SU, JIAN XIONG
Executed: 2007-04-30
KUAH, TENG HOCK
Executed: 2007-04-30
CHIW, EE LING
Executed: 2007-04-30
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD.
2 YISHUN AVENUE 7, SINGAPORE 768924, SINGAPORE
Covered Property (1)
Compression Molding of an Electronic Device
Patent: 8,011,917 →
Application: 11/746,291 →
Publication: US 2008/0277829
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →