Patent Assignment
Reel/Frame 062444/0830
Change of Name
Recorded: 2023-01-20
Pages: 6
Assignor
ASM TECHNOLOGY SINGAPORE PTE LTD
Executed: 2022-07-25
Assignee
ASMPT SINGAPORE PTE. LTD.
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Properties
(138)
Method and Apparatus for Molding with Reduced Cull Formation
Gantry Positioning System
Transducer and Method for Mounting the Same
Flanged Transducer Having Improved Rigidity
Vacuum Wire Tensioner for Wire Bonder
Compression Molding of an Electronic Device
Wire Bonding Apparatus Comprising Rotary Positioning Stage
Molding Apparatus Incorporating Pressure Uniformity Adjustment
Robotic Arm Driving Mechanism
Bonding Machine Incorporating Dual-Track Transfer Mechanism
Optical Device Molding System
Automatic Wire Feeding Method for Wire Bonders
Modular Molding Assembly for Electronic Devices
Substrate Carrier for Molding Electronic Devices
Apparatus for Increasing Coverage of Shielding Gas During Wire Bonding
Apparatus for Molding Electronic Components
Runner System for Supplying Molding Compound
Method of Configuring a Dicing Device, and a Dicing Apparatus for Dicing a Workpiece
Flip Arm Module for a Bonding Apparatus Incorporating Changeable Collet Tools
Apparatus for Delivering Semiconductor Components to a Substrate
Apparatus and Method for Inspecting an Object with Increased Depth of Field
Apparatus for Thin-Film Deposition
Laser Apparatus for Singulation, and a Method of Singulation
Apparatus for Electroplating a Tooling for Use in Semiconductor Device Encapsulation
Asymmetric Pattern Projection Apparatus
Apparatus for Assembling a Lens Module and an Image Sensor to Form a Camera Module, and a Method of Assembling the Same
Apparatus for Bonding Substrates to Each Other
Universal Bond Head for Wire Bonders
Patent:
8,434,669 →
Application:
13/344,172 →
Method and Apparatus for Fabricating a Light-Emitting Diode Package
Method of Recovering a Bonding Apparatus from a Bonding Failure
Apparatus for Conducting Automated Maintenance of a Test Contactor Module
Wire Bonder Including a Transducer, a Bond Head, and a Mounting Apparatus
Thermal Compression Bonding of Semiconductor Chips
Vibratory Feeder for Conveying Components
Image-Assisted System for Adjusting a Bonding Tool
Apparatus for Aligning a Bonding Tool of a Die Bonder
Patent:
8,387,851 →
Application:
13/463,910 →
Apparatus and Method for Determining an Alignment of a Bondhead of a Die Bonder Relative to a Workchuck
Apparatus for Heating a Substrate During Die Bonding
Bond Pad Assessment for Wire Bonding
Feed-Through Apparatus for a Chemical Vapour Deposition Device
Wedge Bonder and a Method of Cleaning a Wedge Bonder
Laser Processing Method and Apparatus
Apparatus and Method for Supporting a Workpiece During Processing
Lead Frame Support Plate and Window Clamp for Wire Bonding Machines
Bond Head for Thermal Compression Die Bonding
Chromatic Confocal Scanning Apparatus
Transfer Apparatus for Transferring Electronic Devices
Test Contactor for Electrical Testing of Electronic Components
Vibration Feeding Apparatus and Method
Device Sorting Apparatus
Patent:
8,631,923 →
Application:
13/630,071 →
Automatic Wire Tail Adjustment System for Wire Bonders
Method of Detecting Wire Bonding Failures
Apparatus and Method for Locating a Plurality of Placement Positions on a Carrier Object
Handling System for Testing Electronic Components
Device for Holding Multiple Semiconductor Devices During Thermocompression Bonding and Method of Bonding
Screen Printer, and Method of Cleaning a Stencil of a Screen Printer
Apparatus for Processing Electronic Devices
Singulation Apparatus and Method
Wire Clamp with Piezoelectric Actuator and Method and Apparatus for Applying a Preload Force to the Piezoelectric Actuator
3D Display Alignment Method
Singulation Apparatus Comprising an Imaging Device
Wire Bonder and Method of Calibrating a Wire Bonder
Active Vibration Absorber
Apparatus for Handling Electronic Components
Lead Frame Support Plate and Window Clamp for Wire Bonding Machines
Transfer Apparatus for Transferring Electronic Devices and Changing Their Orientations
Transfer Device for Holding an Object Using a Gas Flow
Rapid Cooling System for a Bond Head Heater
Apparatus and Method of Using an Imaging Device for Adjustment of at Least One Handling Device for Handling Semiconductor Components
Method and Apparatus for Measuring a Free Air Ball Size During Wire Bonding
Apparatus and Method for Reconstructing a Three-Dimensional Profile of a Target Surface
Method for aligning electronic components
Molding Press and a Platen for a Molding Press
Die Bonding Tool and System
Apparatus and Method for Arranging Integrated Circuit Receiving Tubes
Bond Head Cooling Apparatus
System and Method for Detecting Leakage in a Gas Pipeline
Wire Spool System for a Wire Bonding Apparatus
Method and System for Pull Testing of Wire Bonds
Die Bonder and a Method of Cleaning a Bond Collet
Led Testing Process and Correction Methods Therefor
Test Handler That Picks Up Electronic Devices for Testing and an Orientation-Changing Apparatus for Use in a Test Handler
High Throughput Test Handler System
Thermally-Enhanced Provision of Underfill to Electronic Devices Using a Stencil
Die Bonding with Liquid Phase Solder
Apparatus for Testing Multiple Semiconductor Dice with Increased Throughput
Semiconductor Package Testing Apparatus
Electrical Contact Having Electrically Isolated Members for Contacting an Electrical Component
Wire Bonding Apparatus Comprising an Oscillator Mechanism
Apparatus and Method for Adjustment of a Handling Device for Handling Electronic Components
Apparatus and Method for Transferring Electronic Devices
Patent:
9,561,914 →
Application:
14/881,399 →
Active Lens Alignment System
Pick and Place Device Comprising Pick Arm Correction Module
Semiconductor Encapsulation System Comprising a Vacuum Pump and a Reservoir Pump
Electronic Device Separator for a Feeding Apparatus
Die Bonding Apparatus Comprising an Inert Gas Environment
Magnet Assembly Mounting Arrangement for an Electromagnetic Motor
Molding System for Applying a Uniform Clamping Pressure Onto a Substrate
Apparatus and Method for Transferring Electronic Devices
System for Adjusting Relative Positions Between Components of a Bonding Apparatus
Method of Forming Three-Dimensional Wire Loops and Wire Loops Formed Using the Method
Patent:
9,881,891 →
Application:
15/351,652 →
Confocal Imaging of an Object Utilising a Pinhole Array
Vertical Chromatic Confocal Scanning Method and System
Method and System for Automatic Bond Arm Alignment
Pick Arm Comprising a Winged Part for a Bonding Apparatus
Method for Manufacturing a Light Emitting Diode Device and the Light Emitting Diode Device So Manufactured
Patent:
10,014,450 →
Application:
15/428,302 →
Apparatus for Securing Electronic Devices on a Carrier During Transportation
Method and Apparatus for Aligning Electronic Components
Three-Dimensional Imaging Using a Multi-Phase Projector
Patent:
10,036,630 →
Application:
15/601,036 →
Method and Apparatus for Aligning and Inspecting Electronic Components
Wireless Signal Transmission in a Pick-and-Place Apparatus
Apparatus and Method for Processing a Semiconductor Device
Gang Bonding Process for Assembling a Matrix of Light-Emitting Elements
Patent:
10,186,549 →
Application:
15/710,019 →
Detection of Foreign Particles During Wire Bonding
Method for Manufacturing Wafer-Level Semiconductor Packages
Apparatus and Method for Dispensing a Viscous Adhesive
Multiple Actuator Wire Bonding Apparatus
Apparatus and Method for Inspecting Substantially Transparent Electronic Devices
Apparatus and Method for Authentication of Electronic Device Test Stations
Bonding Apparatus with Replaceable Bonding Tool
Driving System Having Reduced Vibration Transmission
Apparatus for Packing Ultra-Small Electronic Devices
Apparatus and Method Inspecting Bonded Semiconductor Dice
Die Bonder Incorporating Rotatable Adhesive Dispenser Head
Heating of a Substrate for Epoxy Deposition
Formation of Bonding Wire Vertical Interconnects
Automated Particle Removal System
Apparatus for Determining an Orientation of a Die
Patent:
10,684,118 →
Application:
16/378,758 →
Aligning an Image Sensor Relative to a Lens Module
Collet Inspection in a Semiconductor Pick and Place Apparatus
High-Precision Bond Head Positioning Method and Apparatus
Patent:
10,861,819 →
Application:
16/503,678 →
Apparatus for Transferring Electronic Devices
Patent:
10,748,794 →
Application:
16/505,830 →
Apparatus Using Reflective Elements for Aligning a Lens Module with an Image Sensor
Wire Bonding Apparatus Threading System
Direct Transfer Apparatus for Electronic Components
Bonding Apparatus Incorporating Variable Force Distribution
Testing of Led Devices During Pick and Place Operations
Aligning Lens Elements in a Lens Module Relative to an Image Sensor
Patent:
11,283,978 →
Application:
17/070,984 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 20, 2005
From: CHEN, XIANG; HO, SHU CHUEN; KUAH, TENG HOCK ERIC; LU, SI LIANG
To: ASM TECHNOLOGY SINGAPORE PTE LTD.
Reel/Frame 016478/0073 →
Assignment of Assignor's Interest
Jan 24, 2006
From: GAUNEKAR, AJIT; WIDDOWSON, GARY PETER
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 017560/0898 →
Assignment of Assignor's Interest
May 3, 2006
From: NARASIMALU, SRIKANTH; LIM, CHEE TIONG; BALAKRISHNAN, SATHISH KUMAR
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 017834/0536 →
Assignment of Assignor's Interest
Nov 24, 2006
From: LI, HING LEUNG MARCHY; YEAP, BOON JUNE EDWIN; KWAN, KA SHING KENNY; CHAN, MAN
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 018549/0580 →
Assignment of Assignor's Interest
May 4, 2007
From: KWAN, KA SHING KENNY; ZHANG, YUE; WONG, YAM MO
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 019251/0021 →
Assignment of Assignor's Interest
Jun 5, 2007
From: HAO, JI YUAN; ONG, SEE YAP; SU, JIAN XIONG; KUAH, TENG HOCK
To: ASM TECHNOLOGY SINGAPORE PTE LTD.
Reel/Frame 019378/0606 →
Assignment of Assignor's Interest
Aug 16, 2007
From: OU, GANG; GAUNEKAR, AJIT; ZHANG, DONGSHENG; KWAN, KA SHING KENNY
To: ASM TECHNOLOGY SINGAPORE PTE LTD.
Reel/Frame 019706/0672 →
Assignment of Assignor's Interest
Apr 24, 2008
From: ZHANG, DONGSHENG; GAUNEKAR, AJIT; OU, GANG
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 020851/0471 →
Assignment of Assignor's Interest
May 12, 2008
From: NARASIMALU, SRIKANTH; BALAKRISHNAN, SATHISH KUMAR; YING, NING; HO, SHU CHUEN
To: ASM TECHNOLOGY SINGAPORE PTE LTD.
Reel/Frame 020935/0611 →
Assignment of Assignor's Interest
Jul 24, 2009
From: SONG, KENG YEW JAMES; KWAN, KA SHING KENNY; LUM, CHOONG KEAD LESLIE; HE, TING YU
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 023002/0133 →
Assignment of Assignor's Interest
Oct 14, 2009
From: HO, SHU CHUEN; KUAH, TENG HOCK ERIC; HAO, JI YUAN; CHIW, EE LING
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 023369/0724 →
Assignment of Assignor's Interest
Oct 29, 2009
From: ZHANG, YUE; SONG, KENG YEW JAMES; CHEN, XIAO LIANG
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 023442/0758 →
Assignment of Assignor's Interest
Mar 1, 2010
From: HO, SHU CHUEN; WU, JIAN; CHEONG, CHOON HONG; TEH, CHEE TOH
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 024003/0973 →
Assignment of Assignor's Interest
Jul 15, 2010
From: KUAH, TENG HOCK; ONG, SEE YAP; HAO, JI YUAN; WU, KAI
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 024688/0765 →
Assignment of Assignor's Interest
Dec 14, 2010
From: SONG, KENG YEW JAMES; KWAN, KA SHING KENNY; YEAP, BOON JUNE; CHEN, SHI JIE
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 025489/0163 →
Assignment of Assignor's Interest
Apr 5, 2011
From: HO, SHU CHUEN; LU, SI LIANG; MOK, SWEE KWONG; YAN, KAR WENG
To: ASM TECHNOLOGY SINGAPORE PTE LTD.
Reel/Frame 026075/0069 →
Assignment of Assignor's Interest
Apr 13, 2011
From: HO, SHU CHUEN; LU, SI LIANG; MOK, SWEE KWONG; YAN, KAR WENG
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 026113/0281 →
Corrective Assignment to Correct the Assignee's Address. the Assignee's Address Should Be 2 Yishun Avenue 7, Singapore, Singapore 768924 Previously Recorded on Reel 026075 Frame 0069. Assignor(S) Hereby Confirms the Assignment.
May 4, 2011
From: HO, SHU CHUEN; LU, SI LIANG; MOK, SWEE KWONG; YAN, KAR WENG
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 026217/0840 →