IP Library Granted Patent US 9,461,013
Granted Patent B2
US 9,461,013 · App. 14/549,771 · Granted Oct 4, 2016

Wire spool system for a wire bonding apparatus

Inventors: Chi Wah Cheng (Tsing Yi, HK); Hon Kam Ng (Tsing Yi, HK)
Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
H01L24/78B65H51/02B65H51/20B65H59/00B65H63/06H01L2224/7855H01L2224/78601H01L2224/78611H01L2224/78901
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Quick Facts
Patent No.
US 9,461,013
App. No.
14/549,771
Granted
Oct 4, 2016
Kind
B2
Abstract

Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.

Claims (29)

1. A wire spool system for a wire bonding apparatus, comprising:

a wire reel arranged to receive a wire;

a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus;

a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide; and

an imaging module comprising a camera having an image sensor, and an image processing unit;

wherein the camera is positioned to image, by said image sensor, at least a portion of the wire path between the wire reel and the wire guide to generate image data, and wherein the image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path between the wire reel and the wire guide.

2. A wire spool system for a wire bonding apparatus comprising:

a wire reel arranged to receive a wire;

a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus;

a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide;

an imaging module comprising a camera having an image sensor, and an image processing unit;

wherein the camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data, and wherein the image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path; and

a buffer region intermediate the tensioning mechanism and the wire guide, wherein the camera is positioned in the buffer region.

3. A wire spool system for a wire bonding apparatus, comprising:

a wire reel arranged to receive a wire;

a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus;

a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide; and

an imaging module comprising a camera having an image sensor, and an image processing unit;

wherein the camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data, and wherein the image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path; and

wherein the image data are indicative of a first image captured prior to a movement of the bond head, and a second image captured after the movement of the bond head; and wherein the image processing unit is configured to determine, from said first and second images, whether the at least a portion of the wire path has moved as a result of the movement of the bond head.

4. A wire spool system according to claim 3 , wherein the image processing unit is configured to determine a length of wire which has been paid out as a result of the movement of the bond head.

5. A wire spool system for a wire bonding apparatus, comprising:

a wire reel arranged to receive a wire;

a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus;

a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide; and

an imaging module comprising a camera having an image sensor, and an image processing unit;

wherein the camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data, and wherein the image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path; and

wherein the image processing unit is configured to determine, from said image data, a cross-sectional shape and/or diameter of the wire.

6. A wire spool system according to claim 1 , wherein the camera has a resolution capable of detecting a wire movement of 100 μm or less.

Assignments (2)
CHANGE OF NAME Recorded Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2014
From: CHENG, CHI WAH; NG, HON KAM
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 034427/0864 →
Continuity (1)
Related Publication 20160148898A1 · May 26, 2016