Rapid cooling system for a bond head heater
A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.
1. A bond head, comprising:
an insulation block;
a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device, the heater plate being operative to heat the semiconductor device that is held by the collet; and
a flow generation plate that is detachably mounted between the insulation block and the heater plate which is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate;
wherein the flow generation plate is clamped between the insulation block and the heater plate such that a first planar surface of the flow generation plate faces the insulation block and a second planar surface of the flow generation plate that is opposite to the first planar surface faces the heater plate.
2. The bond head as claimed in claim 1 , wherein the flow generation plate comprises a plurality of slots near a central portion of the flow generation plate, such that cooling gas is configured to be introduced through the plurality of slots centrally onto the heater plate in directions toward outer edges of the heater plate.
3. The bond head as claimed in claim 2 , wherein the slots are machined onto the flow generation plate before mounting the flow generation plate between the insulation block and the heater plate.
4. The bond head as claimed in claim 2 , wherein the slots have openings that are wider on a side of the flow generation plate facing the insulation block as compared to another side of the flow generation plate facing the heater plate.
5. The bond head as claimed in claim 4 , wherein the flow generation plate includes a gas chamber located adjacent to the slot on the side of the flow generation plate facing the insulation block.
6. The bond head as claimed in claim 2 , wherein the plurality of slots comprises at least one longitudinal slot extending centrally along a majority of a length of the flow generation plate facing the heater plate for introducing cooling gas centrally onto the heater plate.
7. The bond head as claimed in claim 2 , wherein the cooling gas that is introduced through the slots is diverted in flow directions which spread out over a gap between facing surfaces of the flow generation plate and the heater plate, so as to cool the heater plate.
8. The bond head as claimed in claim 7 , wherein the cooling gas is spread out along the gap between the flow generation plate and the heater plate towards openings between the flow generation plate and side surfaces of the insulation block where heated cooling gas escapes.
9. The bond head as claimed in claim 7 , wherein a height of the gap formed between the facing surfaces of the flow generation plate and the heater plate is between 0.1 mm and 1.5 mm.
10. The bond head as claimed in claim 2 , wherein a width of each slot is less than 1 mm.
11. The bond head as claimed in claim 10 , wherein the width of each slot is between 0.1 mm and 0.7 mm.
12. The bond head as claimed in claim 1 , further comprising a through-hole located centrally in the flow generation plate for insertion of a protrusion extending from the insulation block.
13. The bond head as claimed in claim 12 , further comprising peripheral flow slots in the flow generation plate that extend alongside opposite edges of the through-hole.
14. The bond head as claimed in claim 13 , further comprising inlet openings formed between the flow generation plate and the protrusion near a center of the heater plate for introducing cooling gas through the inlet openings onto the heater plate, and outlet openings between the flow generation plate and side surfaces of the insulation block near opposite edges of the heater plate where heated cooling gas escapes.
15. The bond head as claimed in claim 1 , further comprising heater fins comprising grooved indentations incorporated on a surface of the heater plate facing the flow generation plate.
16. The bond head as claimed in claim 1 , wherein the flow generation plate is made from graphite or stainless steel.
17. The bond head as claimed in claim 1 , wherein a total thermal mass of the flow generation plate is less than 50% of a cut-off volume in the insulation block for reducing a thermal mass of the insulation block.
18. A flow generation plate for a bond head comprising an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device, the heater plate being operative to heat the semiconductor device that is held by the collet, wherein:
the flow generation plate is detachably mountable between the insulation block and the heater plate and is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate; and
the flow generation plate is clamped between the insulation block and the heater plate when it is mounted such that a first planar surface of the flow generation plate faces the insulation block and a second planar surface of the flow generation plate that is opposite to the first planar surface faces the heater plate.