Apparatus for electroplating a tooling for use in semiconductor device encapsulation
An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.
1. An apparatus for electroplating inside walls of a plurality of gates of a transfer mold, the transfer mold being for encapsulating semiconductor devices, the apparatus comprising:
a plurality of electrodes configured to act as anodes during electroplating, each electrode of the plurality of electrodes comprising:
a head portion; and
a shaft portion configured to be inserted into a respective interior space of a gate of the transfer mold;
a fixture; and
a plurality of through-holes in the fixture, each through-hole comprising:
a counterbore configured to engage with the head portion of a respective electrode to prevent further entry of the electrode into the through-hole; and
a bore for receiving the shaft portion of the respective electrode configured to electroplate the inside wall of the respective gate of the transfer mold,
wherein diameters of the bores of the through-holes are smaller than the diameters of the shaft of the electrodes, and the bores of the through-holes receive the shaft of the electrodes in a slide-fit to form a mutual interference fit to thereby secure the electrodes to the fixture,
wherein the shaft portions of the electrodes are configured to protrude from the fixture.
2. The apparatus of claim 1 , wherein each through-hole has a depth of more than 6 mm.
3. The apparatus of claim 1 , wherein the fixture further comprises a bore located next to each through-hole, the bore being configured to receive a securing device so that a head portion of the securing device at least partially covers the through-hole to retain the electrode in the fixture.
4. The apparatus of claim 1 , wherein the fixture further comprises at least one air-release feature configured to allow release of gases through the fixture.
5. The apparatus of claim 4 , wherein the at least one air-release feature is a slot.
6. The apparatus of claim 5 , wherein the slot has a width of 4 mm.
7. The apparatus of claim 1 , further comprising a plurality of stoppers configured to separate the fixture at a fixed distance from the transfer mold.
8. The apparatus of claim 7 , wherein the plurality of stoppers are arranged at respective edges of the fixture.
9. The apparatus of claim 7 , wherein each of the plurality of stoppers has a thickness of less than 12 mm.
10. The apparatus of claim 7 , wherein each of the plurality of stoppers is made of polymer plastic.
11. The apparatus of claim 7 , wherein the fixture further comprises a plurality of stopper bores configured to receive respective threaded parts configured to secure the plurality of stoppers.
12. The apparatus of claim 1 , wherein the fixture is made of aluminum.
13. The apparatus of claim 1 , wherein the fixture defines a planar structure.
14. The apparatus of claim 1 , wherein the fixture comprises a plurality of air-release features arranged between adjacent rows of the plurality of through-holes, the plurality of air-release feature being configured to allow release of gases through the fixture.
15. The apparatus of claim 14 , wherein each of the plurality of air-release features is a slot.