IP Library › Assignment 026829/0374
Patent Assignment
Reel/Frame 026829/0374

Corrective Assignment to Correct the Name of the Assignee to: Asm Technology Singapore Pte Ltd. "Singapore" Previously Omitted Previously Recorded on Reel 026805 Frame 0738. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2011-08-30 Pages: 4
Assignors
HO, SHU CHUEN
Executed: 2011-08-18
YIP, KAI FAT
Executed: 2011-08-18
CHNG, ENG CHENG
Executed: 2011-08-07
NGO, YEW LAN
Executed: 2011-08-18
DAMODARAN, SARAVANA RANGANATHAN
Executed: 2011-08-18
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property (1)
Apparatus for Electroplating a Tooling for Use in Semiconductor Device Encapsulation
Patent: 9,487,881 →
Application: 13/184,675 →
Publication: US 2013/0020193
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 25, 2011
From: HO, SHU CHUEN; YIP, KAI FAT; CHNG, ENG CHENG; NGO, YEW LAN
To: ASM TECHNOLOGY PTE LTD.
Reel/Frame 026805/0738 →
Change of Name Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →