Apparatus for handling electronic components
An apparatus for handling electronic components on a lead frame. The apparatus including a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area.
1. An apparatus for handling electronic components on a lead frame, comprising:
a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and
a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area,
wherein the lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area.
2. The apparatus of claim 1 , wherein the guide further comprises:
a pitch adjustment section for adjusting lateral distances between the electronic components that are adjacent in the lanes to a desired lateral distance; and
a levelling section for adjusting relative levels of the electronic components to the common level.
3. An apparatus according to claim 2 , wherein the guide further comprises a transport section arranged before the pitch adjustment section.
4. An apparatus according to claim 3 , wherein the transport section comprises at least one inclined section such that the electronic components are movable along the transport section at least partly under the influence of gravity.
5. An apparatus according to claim 1 , further comprising a pneumatic blower for moving the electronic components along the guide.
6. An apparatus according to claim 2 , wherein the lanes running along the pitch adjustment section diverge to increase the lateral distances between the electronic components.
7. An apparatus according to claim 2 , wherein the levelling section comprises first lanes configured to receive the electronic components along a first level, and second lanes configured to receive the electronic components along one or more levels that are different from the first level, said second lanes each having a downward incline terminating along the first level.
8. An apparatus according to claim 2 , wherein the pitch adjustment section is separate from the level adjustment section.
9. A guide for an apparatus for handling electronic components on a lead frame, said apparatus comprising a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into two or more layers along different levels, the guide being capable of coupling to the singulation device at a first end and to an output area at a second end, the guide comprising:
a plurality of lanes running along a surface of the guide, the lanes being configured to transport the electronic components from the first end of the guide to the second end of the guide,
wherein the lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area.
10. The guide according to claim 9 , further comprising
a pitch adjustment section for adjusting lateral distances between the electronic components; and
a levelling section for adjusting relative levels of the electronic components to the common level.
11. A guide according to claim 10 , further comprising a transport section arranged before the pitch adjustment section.
12. A guide according to claim 11 , wherein the transport section comprises at least one inclined section such that the electronic components are movable along the transport section at least partly under the influence of gravity.
13. A guide according to claim 10 , wherein the levelling section comprises first lanes configured to receive the electronic components along a first level, and second lanes configured to receive the electronic components along one or more levels that are different from the first level, said second lanes each having a downward incline terminating at the first level.
14. A guide according to claim 10 , wherein the pitch adjustment section is separate from the level adjustment section.