Bonding apparatus incorporating variable force distribution
A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member.
1. A bonding apparatus comprising:
a holding element configured to hold an electrical component;
a plurality of holding element actuators configured to move the holding element in one or more actuating directions to contact the electrical component with a base member, wherein the one or more actuating directions are arranged to be generally parallel to a central axis of the holding element extending through the electrical component and the base member;
a plurality of sensors, each sensor being configured to measure a reaction force exerted on the holding element at a respective position on the holding element in response to contact between the electrical component and the base member;
a controller configured, based on the reaction forces measured at the respective positons, to determine bond forces to be exerted at two or more actuating areas of the holding element during a bonding process to bond the electrical component to the base member; and
a plurality of bond force adjusting actuators operative to exert the determined bond forces at the corresponding actuating areas of the holding element during the bonding process.
2. The bonding apparatus according to claim 1 , wherein the holding element and the plurality of bond force adjusting actuators are operatively connected to be movable together in the one or more actuating directions.
3. The bonding apparatus according to claim 1 , further comprising an actuating member connected between the plurality of bond force adjusting actuators and the holding element.
4. The bonding apparatus according to claim 3 , wherein the actuating member comprises a first and a second actuating member portion respectively having a first and a second elongate aperture oriented parallel to the central axis, and wherein the first actuating member portion is nearer to the holding element than the second actuating member portion and the first elongate aperture has a diameter smaller than a diameter of the second elongate aperture.
5. The bonding apparatus according to claim 3 , further comprising a compliant element coupled to the actuating member, wherein the compliant element is compressible by rotation of the actuating member about one or more axes perpendicular to the central axis.
6. The bonding apparatus according to claim 1 , wherein the bond force adjusting actuators are arranged equidistant around the central axis.
7. The bonding apparatus according to claim 1 , wherein the plurality of bond force adjusting actuators comprise first, second, third and fourth bond force adjusting actuators, wherein the first bond force adjusting actuator is arranged diametrically opposite to the third bond force adjusting actuator with respect to the central axis, and the second bond force adjusting actuator is arranged diametrically opposite to the fourth bond force adjusting actuator with respect to the central axis.
8. The bonding apparatus according to claim 1 , wherein at least one of the plurality of bond force adjusting actuators is aligned on an axis that is the same as or parallel to an axis of at least one of the plurality of sensors.
9. The bonding apparatus according to claim 1 , wherein the plurality of bond force adjusting actuators is operative to exert different bond forces at different corresponding actuating areas of the holding element during the bonding process.
10. The bonding apparatus according to claim 1 , wherein the plurality of holding element actuators is operative to tilt the holding element about one or more axes perpendicular to the central axis.
11. The bonding apparatus according to claim 1 , further comprising a plurality of connectors, and each of the plurality of holding element actuators is configured to urge a respective one of the plurality of connectors in one or more directions parallel to the central axis, to move the holding element in the one or more actuating directions.
12. The bonding apparatus according to claim 1 , further comprising a rotational actuator configured to rotate the holding element about the central axis.
13. The bonding apparatus according to claim 1 , wherein the controller is configured to determine the bond force to be exerted by each of the plurality of bond force adjusting actuators based on a reaction force measured by one of the plurality of sensors nearest to the bond force adjusting actuator.
14. The bonding apparatus according to claim 1 , wherein a number of bond force adjusting actuators is equal to a number of sensors.
15. The bonding apparatus according to claim 1 , wherein a number of sensors is more than a number of bond force adjusting actuators.
16. A method for bonding an electrical component to a base member, the method comprising:
moving a holding element holding the electrical component in one or more actuating directions to contact the electrical component with the base member, wherein the one or more actuating directions are generally parallel to a central axis of the holding element extending through the electrical component and the base member;
measuring reaction forces exerted on the holding element with sensors at respective positions on the holding element in response to contact between the electrical component and the base member;
determining bond forces to be exerted on two or more actuating areas of the holding element during a bonding process to bond the electrical component to the base member, wherein the bond forces are determined based on the measured reaction forces; and
exerting the determined bond forces at the actuating areas of the holding element during the bonding process.
17. The method according to claim 16 , wherein moving the holding element further comprises:
tilting the holding element about an axis perpendicular to the central axis;
contacting the electrical component with the base member while the holding element remains tilted; and
rotating the holding element about the axis perpendicular to the central axis to further contact the electrical component with the base member until the electrical component becomes substantially parallel to the base member.
18. The method according to claim 17 , wherein rotating the holding element about the axis perpendicular to the central axis further comprises:
exerting a first force in a direction away from the base member on a first side of the holding element; and
exerting a second force in a direction towards the base member on a second side of the holding element, wherein the second force is larger than the first force.
19. The method according to claim 16 , wherein the reaction forces comprise a first reaction force exerted on a first position of the holding element and a second reaction force exerted on a second position of the holding element, and wherein the method further comprises repeatedly measuring the reaction forces, determining the bond forces based on the measured reaction forces and exerting the determined bond forces on the actuating areas of the holding element until a difference between the first and second reaction forces is below a predetermined threshold.