Assignment of Assignor's Interest

Recorded: 2010-07-15 Pages: 3

Assignors

KUAH, TENG HOCK

Executed: 2010-05-25

ONG, SEE YAP

Executed: 2010-05-24

HAO, JI YUAN

Executed: 2010-05-25

WU, KAI

Executed: 2010-05-24

CHIW, EE LING

Executed: 2010-05-24

Assignee

ASM TECHNOLOGY SINGAPORE PTE LTD

2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE

Covered Property (1)

Substrate Carrier for Molding Electronic Devices

Patent: 9,199,396 →

Application: 12/836,645 →

Publication: US 2012/0013040

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.