Flip arm module for a bonding apparatus incorporating changeable collet tools
An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.
1. A semiconductor device bonding apparatus comprising:
a flip arm for picking up a semiconductor device, the flip arm being operative to invert an orientation of the semiconductor device;
a collet tool detachably mountable onto the flip arm, the collet tool being operative to pick up the semiconductor device and secure the semiconductor device to the flip arm;
a bond arm for picking up the semiconductor device from the collet tool and bonding the semiconductor device to a bonding surface; and
a tool changer module operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm,
wherein the bond arm is coupled to and movable together with the tool changer module.
2. An electronic device bonding apparatus comprising:
a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device;
a collet tool detachably mountable onto the flip arm, the collet tool being operative to contact the electronic device and secure it to the flip arm;
a bond arm for picking up the electronic device from the collet tool and bonding the electronic device to a bonding surface; and
a tool changer module operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm,
wherein the bond arm is coupled to and movable together with the tool changer module.
3. The electronic device bonding apparatus as claimed in claim 2 , wherein the tool changer module further comprises a pair of grippers that are controllable to grip onto or release the collet tool.
4. The electronic device bonding apparatus as claimed in claim 3 , wherein the collet tool comprises a groove onto which the pair of grippers are positionable in order to grip the collet tool.
5. The electronic device bonding apparatus as claimed in claim 2 , further comprising a positioning table on which the tool changer module is installed for moving the tool changer module between the flip arm and a supply of collet tools.
6. The electronic device bonding apparatus as claimed in claim 2 , further comprising a collet holder on the flip arm for mounting the collet tool, wherein the collet holder has a magnetic device configured for mounting the collet tool using a magnetic attraction force.
7. The electronic device bonding apparatus as claimed in claim 2 , further comprising a tool rack configured to hold a plurality of collet tools which may be picked up by the tool changer module.
8. The electronic device bonding apparatus as claimed in claim 7 , wherein the tool rack comprises a row of tool slots, each tool slot being configured to hold one collet tool.
9. The electronic device bonding apparatus as claimed in claim 8 , further comprising a sensor located at each tool slot for detecting whether a collet tool is present on the tool slot.
10. The electronic device bonding apparatus as claimed in claim 7 , further comprising an extendable rod coupled to the tool rack that is operative to drive the tool rack in directions towards or away from the tool changer module.