IP Library Assignment 026075/0069
Patent Assignment
Reel/Frame 026075/0069

Assignment of Assignor's Interest

Recorded: 2011-04-05 Pages: 2
Assignors
HO, SHU CHUEN
Executed: 2011-03-21
LU, SI LIANG
Executed: 2011-03-13
MOK, SWEE KWONG
Executed: 2011-03-21
YAN, KAR WENG
Executed: 2011-03-21
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD.
2 YISHUN AVENUE 7,, SINGAPORE, 76824, SINGAPORE
Covered Property (1)
Apparatus for Molding Electronic Components
Patent: 8,794,952 →
Application: 13/036,074 →
Publication: US 2011/0210477
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Address. the Assignee's Address Should Be 2 Yishun Avenue 7, Singapore, Singapore 768924 Previously Recorded on Reel 026075 Frame 0069. Assignor(S) Hereby Confirms the Assignment. May 4, 2011
From: HO, SHU CHUEN; LU, SI LIANG; MOK, SWEE KWONG; YAN, KAR WENG
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 026217/0840 →
Change of Name Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →