Apparatus for molding electronic components

1. A molding apparatus configured to encapsulate an electronic device in a molding compound to form a molded semiconductor package, the molding apparatus comprising:

a first mold chase, a second mold chase and a middle plate which are configured to be clamped together with the electronic device, the middle plate being arranged between the first mold chase and second mold chase during molding;

a molding cavity wholly defined by a cavity formed on one side of the middle plate for receiving molding compound; and

a package pin mounted onto the middle plate and movable with the middle plate relative to both the first and second mold chases during a molding process, a portion of the package pin being positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

2. The molding apparatus as claimed in claim 1 , further comprising a fixer mounted on the middle plate, wherein the fixer includes a head portion abutting against a head portion of the package pin to secure the package pin to the middle plate.

3. The molding apparatus as claimed in claim 2 , wherein the fixer comprises a fixing screw having a threaded stem portion for mounting the fixer to the middle plate.

4. The molding apparatus as claimed in claim 3 , wherein the head portion of the fixer covers a head portion of the package pin.