Apparatus for testing multiple semiconductor dice with increased throughput
A die tester comprising a testing table on which a plurality of dice arranged in an array are mountable, and a first probe and a second probe that are adjustable to a fixed position with a fixed separation distance between the first probe and the second probe. The fixed position corresponds to predetermined test points on the plurality of dice, and the testing table and the first and second probes are movable relative to each other so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die. The die tester further comprises movable third and fourth probes that are movable relative to each other and positionable to test points on a second die of the plurality of dice for testing the second die.
1. A die tester comprising:
a testing table on which a plurality of dice arranged in an array are mountable;
a first probe and a second probe that are adjustable relative to each other in a predetermined XY plane to a fixed position with a fixed separation distance between the first probe and the second probe, wherein the fixed position corresponds to predetermined test points on the plurality of dice; and
wherein the testing table and the first and second probes are movable relative to each other in said predetermined XY plane so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die;
movable third and fourth probes that are movable relative to each other in said predetermined XY plane and positionable to test points on a second die of the plurality of dice for testing the second die.
2. The die tester of claim 1 , further comprising:
an image capturing device configured to capture an image of the plurality of dice; and
a computer processor operative to determine the position of the test points on the plurality of dice based on the image captured by the image capturing device.
3. The die tester of claim 1 , further comprising a first positioning table operatively connected to the third probe and a second positioning table operatively connected to the fourth probe.
4. The die tester of claim 3 , wherein the first positioning table and the second positioning table are movable on a same plane.
5. The die tester of claim 3 , further comprising a first adjustable mount operatively connected to the first probe and a second adjustable mount operatively connected to the second probe.
6. The die tester of claim 5 , further comprising a platform on which the first positioning table and the second positioning table are mounted.
7. The die tester of claim 6 , wherein the first and second adjustable mounts are mounted on the platform.
8. The die tester of claim 7 , wherein:
the platform comprises a through-hole; and
the first positioning table, the second positioning table, the first adjustable mount, and the second adjustable mount are mounted at positions at a perimeter of the through-hole.
9. The die tester of claim 8 , wherein the probes extend generally towards a centre of the through-hole.
10. The die tester of claim 1 , wherein each of the third and fourth probes is configured to move independently of each other.
11. The die tester of claim 1 , wherein the separation distance between corresponding test points of the first die and the second die is 0.5-2 mm.
12. The die tester of claim 1 , wherein the testing table is movable to align the test points of the first die to the first probe and the second probe for testing the first die during relative motion between the testing table and the first and second probes.
13. The die tester of claim 12 , wherein the first probe and the second probe do not move during relative motion between the testing table and the first and second probes.
14. A method of die testing comprising the steps of:
mounting a plurality of dice arranged in an array on a testing table;
adjusting a first probe and a second probe relative to each other in a predetermined XY plane to a fixed position with a fixed separation distance between the first probe and the second probe, wherein the fixed position corresponds to predetermined test points on the plurality of dice;
positioning test points of a first die of the plurality of dice to the first and second probes;
positioning movable third and fourth probes to test points on a second die of the plurality of dice by moving the movable third and fourth probes relative to each other in said predetermined XY plane;
testing the first die; and
testing the second die.
15. The method of claim 14 , wherein the step of positioning the test points of the first die to the first and second probes comprises the step of:
moving the testing table to position the test points of the first die to the first probe and the second probe.
16. The method of claim 14 , further comprising the step of capturing an image of the plurality of dice prior to positioning the test points of the plurality of dice to the respective probes.
17. The method of claim 16 , further comprising the step of determining the positions of the test points on the plurality of dice based on the image captured by the image capturing device.