System for adjusting relative positions between components of a bonding apparatus
A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.
1. A bonding apparatus comprising:
a movable bond head collet;
a reference marker fixedly connected to the bond head collet and configured to move with the bond head collet;
a flip head collet configured to retrieve an electrical component and to transfer the electrical component to the bond head collet;
a first imaging device configured to capture one or more images of the reference marker and the flip head collet when the flip head collet is not carrying the electrical component;
a second imaging device configured to capture one or more images of the reference marker and the bond head collet when the bond head collet is not carrying the electrical component; and
an adjusting mechanism operative to align a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker.
2. The apparatus according to claim 1 , wherein the first and second imaging devices are directed in opposite directions.
3. The apparatus according to claim 1 , wherein the first imaging device is located at a relatively fixed position over the flip head collet.
4. The apparatus according to claim 1 , wherein the reference marker is movable between a position where it is viewable by the first imaging device and another position where it is viewable by the second imaging device.
5. The apparatus according to claim 1 , wherein the reference marker is located on a transparent body.
6. The apparatus according to claim 5 , wherein the transparent body comprises glass.
7. The apparatus according to claim 1 , wherein the offset is determined using:
a distance between the bond head collet and the reference marker as obtained from the one or more images of the bond head collet and the reference marker captured by the second imaging device; and
positions of the reference marker and the flip head collet relative to the first imaging device as obtained from the one or more images of the reference marker and the flip head collet captured by the first imaging device.
8. A bonding apparatus according to claim 1 , further comprising:
a third imaging device configured to capture one or more images of the reference marker and a bonding position at which the bond head collet is operative to bond an electrical component;
wherein the or another adjusting mechanism is operative to align a position of the bond head collet with a position of the bonding position based on an offset that is determined from the images of the bonding position, bond head collet and reference marker.
9. A method for aligning a position of a movable bond head collet with a position of a flip head collet configured to retrieve an electrical component and to transfer the electrical component to the bond head collet, the method comprising the steps of:
capturing one or more images of the flip head collet and a reference marker fixedly connected to the bond head collet and configured to move with the bond head collet using a first imaging device when the flip head collet is not carrying the electrical component, said reference marker being fixedly connected to the bond head collet;
capturing one or more images of the bond head collet and the reference marker using a second imaging device when the bond head collet is not carrying the electrical component;
determining an offset between the flip head collet and the bond head collet using the images of the flip head collet, bond head collet and reference marker; and
adjusting the bond head collet relative to the flip head collet to align the positions of the bond head collet and the flip head collet based on the determined offset.
10. The method according to claim 9 , wherein the first and second imaging devices are directed in opposite directions.
11. The method according to claim 9 , wherein the first imaging device is located at a relatively fixed position over the flip head collet.
12. The method according to claim 9 , wherein the step of capturing one or more images of the reference marker using the second imaging device further comprises the step of moving the reference marker from a position where it is viewable by the first imaging device to another position where it is viewable by the second imaging device.
13. The method according to claim 9 , wherein the reference marker is located on a transparent body.
14. The method according to claim 13 , wherein the transparent body comprises glass.
15. The method according to claim 9 , wherein the offset is determined using:
a distance between the bond head collet and the reference marker as obtained from the one or more images of the bond head collet and the reference marker captured by the second imaging device; and
positions of the reference marker and the flip head collet relative to the first imaging device as obtained from the one or more images of the reference marker and the flip head collet captured by the first imaging device.