Method and apparatus for measuring a free air ball size during wire bonding
Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
1. A method of measuring a free air ball size during a wire bonding process of a wire bonder, the wire bonder having a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire, the method comprising the steps of:
forming a free air ball from a wire tail of the bonding wire;
using the position sensor to determine a positional difference between a free air ball contact position and a corresponding non-free air ball contact position of the bonding tool;
wherein the free air ball contact position of the bonding tool is a position of the bonding tool when the free air ball contacts a conductive surface and the non-free air ball contact position is a position of the bonding tool when the wire tail contacts the conductive surface before the formation of the free air ball;
measuring a volume of the wire tail that has been formed into the free air ball based on the positional difference; and
calculating a volume of the free air ball based on the volume of the wire tail that has been determined from measuring the positional difference.
2. The method of claim 1 , wherein the non-free air ball contact position of the bonding tool is a position of the bonding tool when the wire tail contacts a bonding surface of the semiconductor device.
3. The method of claim 1 , wherein the step of measuring the free air ball volume is based on the conservation of mass between the wire tail and the free air ball.
4. The method of claim 1 , wherein the non-free air ball contact position of the bonding tool is a position of the bonding tool when a base of the bonding tool contacts a bonding surface of the substrate.
5. A method of measuring a free air ball size during a wire bonding process of a wire bonder, the wire bonder having a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire, the method comprising the steps of:
forming a free air ball from a wire tail of the bonding wire;
using the position sensor to determine a positional difference between a free air ball contact position and a non-free air ball contact position of the bonding tool, wherein the free air ball contact position of the bonding tool is a position of the bonding tool when the free air ball contacts a conductive surface; and
measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor;
wherein the non-free air ball contact position of the bonding tool is a position of the bonding tool when a base of the bonding tool contacts the conductive surface; and
the step of measuring the free air ball size further comprises the step of deriving a radius of the free air ball based on a chamfered diameter of the bonding tool and a chamfered angle between the free air ball and the bonding tool.
6. The method of claim 1 , wherein the step of using the position sensor to determine the positional difference of the bonding tool comprises using an encoder to measure respective heights of the bonding tool.
7. The method of claim 1 , wherein the free air ball volume is measured in relation to a radius of the free air ball.
8. The method of claim 1 , wherein the free air ball contact and non-free air ball contact positions of the bonding tool are the respective positions of a base of the bonding tool.