Apparatus and method inspecting bonded semiconductor dice
An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.
1. Apparatus for inspecting a semiconductor die bonded on a top surface of a substrate, the apparatus comprising:
an optical assembly tilted at an oblique angle with respect to the top surface of the substrate, the optical assembly including an image sensor and an optical system;
wherein the optical assembly is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.
2. The apparatus as claimed in claim 1 , wherein a focal point of the optical assembly is arranged such that the image sensor and the focal point are both offset from an optical axis of the optical system.
3. The apparatus as claimed in claim 2 , wherein the image sensor and the focal point are located on opposite sides of the optical axis of the optical system.
4. The apparatus as claimed in claim 2 , wherein the optical assembly is movable relative to the substrate, such that a virtual focal plane of the optical assembly coincident with positions of the focal point as the optical assembly moves is generally parallel to a plane defined by the top surface of the substrate.
5. The apparatus as claimed in claim 4 , wherein a depth of focus of the optical assembly relative to the virtual focal plane is configured to extend transversely to the virtual focal plane for a certain distance above and below the virtual focal plane of the optical assembly.
6. The apparatus as claimed in claim 5 , wherein the depth of focus of the optical assembly corresponds to a vertical side wall of the semiconductor die for ensuring that an image of a top of a fillet surrounding the semiconductor die along the side wall of the semiconductor die which lies within a range of heights outside the virtual focal plane is in focus.
7. The apparatus as claimed in claim 1 , wherein the optical system is tilted with respect to the top surface of the substrate by an angle α, and an image plane of the image sensor is tilted with respect to the optical system by an angle α′ such that: tan α=M tan α′; the optical system comprises a lens assembly, where M is a magnification factor of the lens assembly comprised in the optical system.
8. The apparatus as claimed in claim 1 , further comprising a second optical assembly, wherein the optical assembly and the second optical assembly are configured to be located on opposite sides of the semiconductor die when in use.
9. The apparatus as claimed in claim 8 , wherein the optical assembly and the second optical assembly are arranged and operative to simultaneously inspect opposite sides of the semiconductor die.
10. The apparatus as claimed in claim 9 , wherein each optical assembly is arranged and operative to inspect two different sides of the semiconductor die respectively at the same time, such that four sides of the semiconductor die are inspected simultaneously.
11. The apparatus as claimed in claim 10 , wherein each optical assembly is positioned at a respective corner of the semiconductor die for viewing the two different sides of the semiconductor die at the same time.
12. The apparatus as claimed in claim 1 , wherein the optical assembly further comprises a mirror that is inclined at an oblique angle with respect to the top surface of the substrate for transmitting light rays reflected from the at least one side wall of the semiconductor die towards the optical system and the image sensor.
13. The apparatus as claimed in claim 12 , wherein the optical system is arranged vertically such that its optical axis is perpendicular to the top surface of the substrate.
14. The apparatus as claimed in claim 13 , wherein the image sensor is tilted at an oblique angle and offset with respect to the optical axis of the optical system.
15. Apparatus for inspecting a semiconductor die bonded on a top surface of a substrate, the apparatus comprising:
a first optical assembly and a second optical assembly, each optical assembly being tilted at an oblique angle with respect to the top surface of the substrate, and each optical assembly including an image sensor and an optical system;
wherein each of the first and second optical assemblies is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.
16. The apparatus as claimed in claim 15 , further comprising a moving mechanism for moving the first and second optical assemblies relative to the substrate for inspecting an array of semiconductor dice bonded on a top surface of the substrate, and the moving mechanism being further operative to rotate the first and second optical assemblies together relative to the substrate.
17. The apparatus as claimed in claim 15 , wherein the first optical assembly is configured and arranged substantially diagonally across from the second optical assembly with respect to the semiconductor die when in use.