Patent Assignment
Reel/Frame 047697/0517
Assignment of Assignor's Interest
Recorded: 2018-12-06
Pages: 4
Assignors
SZE, WUI FUNG
Executed: 2018-11-20
DENG, JIANGWEN
Executed: 2018-12-04
CHOW, LAP KEI
Executed: 2018-12-04
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Apparatus and Method Inspecting Bonded Semiconductor Dice
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.