IP Library Granted Patent US 8,709,916
Granted Patent B2
US 8,709,916 · App. 13/541,865 · Granted Apr 29, 2014

Laser processing method and apparatus

Inventors: Chi Hang Kwok (Hong Kong, HK); Chi Wah Cheng (Hong Kong, HK); Lap Kei Chow (Hong Kong, HK)
Assignee: ASM Technology Singapore Pte Ltd
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Quick Facts
Patent No.
US 8,709,916
App. No.
13/541,865
Granted
Apr 29, 2014
Kind
B2
Abstract

A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.

Claims (9)

1. A laser processing method comprising the steps of:

directing a laser beam to a workpiece; and

effecting relative motion between the laser beam and the workpiece,

wherein the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece, and

the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece.

2. The laser processing method of claim 1 , wherein the laser beam has a pulse energy density of between 0.3 and 0.8 uJ/um, and

the step of focusing the laser beam within the workpiece further comprises focusing the laser beam within the workpiece at a distance of between 10 and 25 um from the at least one surface of the workpiece.

3. The laser processing method of claim 1 , wherein the laser beam has a pulse energy density of at least 0.5 uJ/um, and

the step of focusing the laser beam within the workpiece further comprises focusing the laser beam within the workpiece at a distance of between 25 and 40 um from the at least one surface of the workpiece.

Assignments (2)
CHANGE OF NAME Recorded Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2012
From: KWOK, CHI HANG; CHENG, CHI WAH; CHOW, LAP KEI
To: ASM TECHNOLOGY SINGAPORE PTE LTD
Reel/Frame 028973/0320 →
Continuity (1)
Related Publication 20140011336A1 · Jan 9, 2014