Assignment of Assignor's Interest

Recorded: 2010-03-01 Pages: 2

Assignors

HO, SHU CHUEN

Executed: 2010-01-25

WU, JIAN

Executed: 2010-01-25

CHEONG, CHOON HONG

Executed: 2010-02-09

TEH, CHEE TOH

Executed: 2010-01-19

HUANG, FU SUN

Executed: 2010-01-19

Assignee

ASM TECHNOLOGY SINGAPORE PTE LTD

2 YISHUN AVENUE 7, 768924, SINGAPORE

Covered Property (1)

Modular Molding Assembly for Electronic Devices

Patent: 8,419,404 →

Application: 12/701,036 →

Publication: US 2011/0195140

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.