Die bonder and a method of cleaning a bond collet

1. A die bonder, comprising:

a movable bond collet for holding an electronic device;

a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface, wherein the platform is movable between a first position and a second position;

a biasing mechanism configured to bias the platform towards the first position; and

a cleaning agent supply;

wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.

2. The die bonder of claim 1 , wherein the cleaning surface comprises a textile material.

3. The die bonder of claim 2 , wherein the textile material comprises a clean room cloth.

4. The die bonder of claim 1 , wherein the cleaning agent supply is operative to provide further cleaning agent to the cleaning surface each time the bond collet contacts the platform.

5. The die bonder of claim 1 , wherein the biasing mechanism comprises a helical spring.

6. The die bonder of claim 1 , wherein the cleaning agent supply is operative to provide further cleaning agent to the cleaning surface each time the bond collet moves the platform away from the first position.

7. The die bonder of claim 1 , further comprising a pump for pumping the cleaning agent from the cleaning agent supply so as to provide the cleaning agent to the cleaning surface.

8. The die bonder of claim 7 , wherein the pump is an antistatic pump.

9. The die bonder of claim 7 , wherein the cleaning agent supply comprises a container on which the platform is mounted.

10. A die bonder, comprising:

a movable bond collet for holding an electronic device;

a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface;

a resilient material on which the cleaning surface is arranged, so as to reduce impact on the bond collet when the bond collet contacts the cleaning surface; and

a cleaning agent supply;

wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.

11. The die bonder of claim 10 , wherein the resilient material is a rubber sheet.

12. The die bonder of claim 1 , further comprising a camera adjacent to which the bond collet is positionable for inspecting the bond collet after the bond collet has been cleaned on the cleaning surface.

13. A method of cleaning a bond collet of a die bonder which is configured for holding an electronic device, the method comprising the steps of:

providing a cleaning agent to a cleaning surface comprised in a platform from a cleaning agent supply;

contacting the bond collet on the cleaning surface;

pushing the platform with the bond collet from a first position to a second position when contacting the bond collet on the cleaning surface; and

cleaning the bond collet on the cleaning surface.

14. The method of claim 13 , further comprising the step of dispensing the cleaning agent to the cleaning surface when the platform is pushed away from the first position.

15. The method of claim 13 , wherein the step of dispensing the cleaning agent to the cleaning surface is carried out by a pump.

16. The method of claim 13 , further comprising the step of inspecting the bond collet with a camera after cleaning the bond collet.