Die bonding tool and system
Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.
1. A die bonding tool comprising:
a rigid body; and
a collet having a die-holding portion;
wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly bend relative to the rigid body on application of a torque to the collet and/or to a die held by the collet.
2. A die bonding tool according to claim 1 , wherein the flexible element comprises a shaft having a first section, a second section, and at least one peripheral cut-out portion defining gaps in the flexible element intermediate the first and second sections, such that the first and second sections are flexible relative to each other.
3. A die bonding tool according to claim 2 , wherein the cut-out portion is a helical cut-out portion which extends at least once around the perimeter of the shaft.
4. A die bonding tool according to claim 1 , wherein the collet comprises a stand-off feature extending away from a surface of the collet and spaced from the die-holding portion.
5. A die bonding tool according to claim 4 , wherein the stand-off feature comprises a stand-off element at each corner of the collet.
6. A die bonding tool according to claim 4 , wherein the stand-off feature extends from the surface at a predetermined distance which depends on a desired bond line thickness.
7. A die bonding tool according to claim 5 , wherein each stand-off element is removably attached to the surface of the collet.
8. A die bonding system for attaching a semiconductor die to a substrate, the die bonding system comprising:
a die bonding tool according to claim 1 ; and
a die attach platform configured to support the substrate.
9. A die bonding system according to claim 8 , wherein the flexible element comprises a shaft having a first section, a section section, and at least one peripheral cut-out portion intermediate the first and second sections, such that the first and second sections are flexible relative to each other.
10. A die bonding system according to claim 9 , wherein the cut-out portion is a helical cut-out portion which extends at least once around the perimeter of the shaft.
11. A die bonding system according to claim 8 , wherein the collet comprises a stand-off feature extending from a surface of the collet and spaced from the die-holding portion.
12. A die bonding system according to claim 11 , wherein the stand-off feature comprises a stand-off element at each corner.
13. A die bonding system according to claim 11 , wherein the stand-off feature extends from the surface at a predetermined distance which depends on a desired bond line thickness.
14. A die bonding system according to claim 11 , wherein each stand-off element is removably attached to the surface of the collet.
15. A die bonding system according to claim 8 , further comprising an adhesive dispenser, the adhesive dispenser having a dispensing end which is oriented to apply adhesive to an underside of a semiconductor die secured at the die-holding portion.
16. A die bonding system according to claim 8 , wherein the die attach platform comprises at least one heating element.
17. A die bonding system according to claim 8 , further comprising an up-look camera configured to inspect an underside of a semiconductor die secured at the die-holding portion.