IP Library Assignment 034125/0023
Patent Assignment
Reel/Frame 034125/0023

Assignment of Assignor's Interest

Recorded: 2014-11-07 Pages: 2
Assignors
YEUN CHEUNG, KWOK
Executed: 2014-10-21
WAH TONG, KWOK
Executed: 2014-10-21
HUI MENG, JIN
Executed: 2014-10-21
YIN YAU, WAN
Executed: 2014-10-21
KIT CHOW, MAN
Executed: 2014-10-21
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property (1)
Die Bonding Tool and System
Application: 14/489,651 →
Publication: US 2016/0086830
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →