Method of detecting wire bonding failures
Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate.
1. A method of detecting a bonding failure of a wire bonder, the wire bonder comprising a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire, the method comprising the steps of:
forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire;
forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds;
moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond;
detecting that the second wire bond does not remain bonded to the substrate; and
determining an occurrence of the bonding failure,
wherein the step of detecting that the second wire bond does not remain bonded to the substrate comprises the steps of:
moving the bonding tool in a direction towards the substrate while detecting a position of the bonding tool at which an electrical connection occurs between the bonding wire and the substrate;
comparing the detected position of the bonding tool with a predetermined position of the bonding tool, the predetermined position of the bonding tool indicating an absence of a bonding failure;
detecting that the detected position of the tip of the bonding tool does not substantially correspond to the predetermined position of the bonding tool; and
determining that the second wire bond is no longer bonded to the substrate.
2. The method of claim 1 , wherein the step of moving the bonding tool in the direction away from the second wire bond comprises the step of moving the bonding tool in upward and sideways directions.
3. The method of claim 1 , wherein the step of moving the bonding tool in the direction away from the second wire bond to break the bonding wire from the second wire bond comprises the step of positioning the bonding tool at a predetermined position before the bonding wire is clamped to pull the bonding wire from the second wire bond.
4. The method of claim 3 , wherein the predetermined position of the bonding tool is spaced from the second wire bond.
5. The method of claim 1 , wherein the detected position of the bonding tool does not substantially correspond to the predetermined position of the bonding tool if it is outside a tolerance range of 20% from the predetermined position.
6. The method of claim 1 , wherein the detected position of the bonding tool does not substantially correspond to the predetermined position of the bonding tool if it is outside a tolerance range of 10% from the predetermined position.
7. The method of claim 1 , wherein the detected position of the bonding tool does not substantially correspond to the predetermined position of the bonding tool if it is outside a tolerance range of 5% from the predetermined position.