IP Library Assignment 019405/0474
Patent Assignment
Reel/Frame 019405/0474

Assignment of Assignor's Interest

Recorded: 2007-06-11 Pages: 8
Assignors
OLSON, KEVIN C.
Executed: 2007-05-22
WANG, ALAN E.
Executed: 2007-06-04
Assignee
PPG INDUSTRIES OHIO, INC.
3800 WEST 143RD STREET, CLEVELAND, OHIO, 44111
Covered Property (1)
Method of Forming Solid Blind Vias Through the Dielectric Coating on High Density Interconnect Substrate Materials
Patent: 8,008,188 →
Application: 11/760,804 →
Publication: US 2008/0305626
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License Dec 13, 2010
From: GENERAL ELECTRIC COMPANY
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 025578/0739 →