Patent Assignment
Reel/Frame 019406/0844
Assignment of Assignor's Interest
Recorded: 2007-06-11
Pages: 8
Assignors
BELL, ANDREW
Executed: 2007-05-11
ZHANG, WEI
Executed: 2007-05-11
NEAL, PHIL
Executed: 2007-05-14
APANIUS, CHRIS
Executed: 2007-05-04
SHICK, ROBERT A.
Executed: 2007-05-04
NG, HENDRA
Executed: 2007-05-04
Assignee
PROMERUS LLC
9921 BRECKSVILLE ROAD, BUILDING R, BRECKSVILLE, OHIO, 44141
Covered Properties
(2)
Methods and Materials Useful for Chip Stacking, Chip and Wafer Bonding
Methods and materials useful for chip stacking, chip and wafer bonding
Application:
60/784,187 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.