Patent Application
Provisional
App. No. 60/784,187
· Confirmation No. 2817
Methods and materials useful for chip stacking, chip and wafer bonding
Provisional Application Expired
Inventors
Chris Apanius
Moreland Hills, OH
Robert A. Shick
Strongsville, OH
Attorneys & Agents of Record
Prosecution
- Customer No.
- 55165
- Docket No.
- PAC206-0001 PRV
- Confirmation No.
- 2817
Child
Claims priority from a provisional application
→
App. 14/457,249
· US 9,263,416
Filed 2014-08-12
· Patented Case
Child
PCT
Claims priority from a provisional application
→
PCT/US2007/007029
Filed 2007-03-21
· RO PROCESSING COMPLETED-PLACED IN STORAGE
Child
Claims priority from a provisional application
→
App. 13/352,424
· US 8,816,485
Filed 2012-01-18
· Patented Case
Child
Claims priority from a provisional application
→
App. 11/726,354
· US 7,932,161
Filed 2007-03-21
· Patented Case
Child
Claims priority from a provisional application
→
App. 11/903,190
· US 8,120,168
Filed 2007-09-20
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2007-06-11
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Quick Facts
- App. No.
- 60/784,187
- Filed
- 2006-03-21
External Links