Patent Assignment
Reel/Frame 019435/0480
Assignment of Assignor's Interest
Recorded: 2007-06-15
Pages: 3
Assignors
MURAMATSU, SHIGETSUGU
Executed: 2007-06-07
KOBAYASHI, TSUYOSHI
Executed: 2007-06-07
KURIHARA, TAKASHI
Executed: 2007-06-07
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Manufacturing Method Thereof, and Semiconductor Apparatus