Patent Assignment
Reel/Frame 019446/0432
Assignment of Assignor's Interest
Recorded: 2007-06-19
Pages: 3
Assignor
KIM, SUNG CHUL
Executed: 2007-04-26
Assignee
SIGO CO., LTD.
#44-12, JINU-RI, DOCHEOK-MYEON, GWANGJU-SI, GYEONGGI-DO, 464-883, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Bonding Semiconductor Chip