Patent Assignment
Reel/Frame 019471/0298
Assignment of Assignor's Interest
Recorded: 2007-06-25
Pages: 3
Assignors
PAN, YU-TANG
Executed: 2007-05-21
CHOU, SHIH-WEN
Executed: 2007-05-21
LIU, MEN-SHEW
Executed: 2007-05-21
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Light Emitting Chip Package and Manufacturing Method Thereof