IP Library › Assignment 019474/0077
Patent Assignment
Reel/Frame 019474/0077

Assignment of Assignor's Interest

Recorded: 2007-06-13 Pages: 2
Assignors
OH, KYUNG SEOB
Executed: 2007-05-02
ROH, JAE KY
Executed: 2007-05-02
PARK, JUNG KYU
Executed: 2007-05-02
BAEK, JONG HWAN
Executed: 2007-05-02
CHOI, SEUNG HWAN
Executed: 2007-05-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
High Power Light Emitting Diode Package and Method of Producing the Same
Patent: 7,598,528 →
Application: 11/808,810 →
Publication: US 2008/0042151
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →