Patent Assignment
Reel/Frame 019502/0839
Assignment of Assignor's Interest
Recorded: 2007-07-02
Pages: 3
Assignors
WANG, MENG-JEN
Executed: 2007-05-02
YANG, KUO-PIN
Executed: 2007-05-02
HSIAO, WEI-MIN
Executed: 2007-05-02
PENG, SHENG-YANG
Executed: 2007-05-02
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAO-HSIUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Packaging Structure Having Electromagnetic Shielding Function and Method for Manufacturing the Same