Patent Assignment
Reel/Frame 019515/0222
Assignment of Assignor's Interest
Recorded: 2007-07-03
Pages: 4
Assignors
PARK, HONG-SICK
Executed: 2006-01-27
KIM, SHI-YUL
Executed: 2006-01-27
CHOUNG, JONG-HYUN
Executed: 2006-01-27
SHIN, WON-SUK
Executed: 2006-01-27
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Etchant, and Method for Fabricating a Thin Film Transistor Substrate Including Conductive Wires Using the Etchant and the Resulting Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.