IP Library › Assignment 019547/0816
Patent Assignment
Reel/Frame 019547/0816

Assignment of Assignor's Interest

Recorded: 2007-07-11 Pages: 4
Assignors
CRUZ, ERWIN VICTOR R.
Executed: 2005-11-21
CABAHUG, ELSIE
Executed: 2005-11-21
SHIAN, TI CHING
Executed: 2005-11-16
IYER, VENKAT
Executed: 2005-11-28
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
82 RUNNING HILL ROAD, MS 35-4E, SOUTH PORTLAND, MAINE, 04106
Covered Property (1)
Semiconductor Die Package Using Leadframe and Clip and Method of Manufacturing
Patent: 7,285,849 →
Application: 11/282,967 →
Publication: US 2007/0114352
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →