IP Library › Assignment 019552/0197
Patent Assignment
Reel/Frame 019552/0197

Assignment of Assignor's Interest

Recorded: 2007-06-29 Pages: 3
Assignors
JEONG, CHUN-SEOK
Executed: 2007-06-27
PARK, KEE-TEOK
Executed: 2007-06-27
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI,, KYOUNGKI-DO 467-860, KOREA, REPUBLIC OF
Covered Property (1)
On Die Thermal Sensor
Patent: 8,140,293 →
Application: 11/819,810 →
Publication: US 2008/0082290