Patent Assignment
Reel/Frame 019552/0305
Assignment of Assignor's Interest
Recorded: 2007-06-29
Pages: 3
Assignor
YAMAMOTO, MASAYUKI
Executed: 2007-06-04
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Method for Joining Adhesive Tape to Semiconductor Wafer, Method for Separating Protective Tape from Semiconductor Wafer, and Apparatuses Using the Methods