Patent Assignment
Reel/Frame 019581/0167
Assignment of Assignor's Interest
Recorded: 2007-07-09
Pages: 2
Assignors
TSUKANO, JUN
Executed: 2007-06-25
OGAWA, KENTA
Executed: 2007-06-25
MAEDA, TAKEHIKO
Executed: 2007-06-25
YAMAMICHI, SHINTARO
Executed: 2007-06-25
KIKUCHI, KATSUMI
Executed: 2007-06-25
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
NEC CORPORATION
1-7 SHIBA 5-CHOME, MINATO-KU, TOKYO 108-8001, JAPAN
Covered Property
(1)
Wiring Substrate, Semiconductor Device, and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.