Patent Assignment
Reel/Frame 025235/0456
Change of Name
Recorded: 2010-11-02
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Information Storage Medium on Which Is Stored an Interconnection Program, Interconnection Method, Interconnection Apparatus, and Semiconductor Device
Semiconductor Device Having a Fuse Element
Semiconductor Integrated Circuit Having Oscillator Frequency Compensation Function
Displaying Apparatus Using Data Line Driving Circuit and Data Line Driving Method
Direct Memory Access Controller Including First and Second Transfer Setting Registers
Electronic Device
Latch Circuit Tolerant to Single Event Transient
Nonvolatile Semiconductor Memory Device and Method of Operating the Same Which Stably Perform Erase Operation
Switch Circuit
Method of Forming a Semiconductor Device Having Bonding Pad of the Second Chip Thinner Than Bonding Pad of the First Chip
Tracking controlling apparatus, method and program
Application:
11/802,456 →
Publication:
US 2007/0286039
Semiconductor Device, Method of Cutting Electrical Fuse, and Method of Determining Electrical Fuse State
Solid-State Imaging Apparatus, Imaging Method, and Imaging System
Semiconductor Device
Method for Manufacuturing Semiconductor Device
Interface Circuit and Memory Controller
Semiconductor Integrated Circuit Including Output Circuit
Serial Communication System with Baud Rate Generator
Semiconductor Device with a Contact Plug Connected to Multiple Interconnects Formed Within
Semiconductor Device
Semiconductor Device Including Esd Protection Field Effect Transistor with Adjustable Back Gate Potential
Image Sensor Having Reset Transistor
Nonvolatile Semiconductor Memory Device and Method of Testing Thereof
Booster Power Supply Circuit and Control Method Therefor and Driver Ic
Driver Circuit and Method for Differential Signaling with Improved Signal Level Control
Semiconductor Device and Method for Determining Fuse State
Automatic numbering method and system exploiting e-mail
Application:
11/806,740 →
Publication:
US 2007/0288570
Electrostatic Discharge Protection Method and Device for Semiconductor Device Including an Electrostatic Discharge Protection Element Providing a Discharge Path of a Surge Current
Bus System, Bus Slave and Bus Control Method
Nonvolatile Semiconductor Memory Device
Electrostatic Discharge Protection Device
Memory Control Circuit, Microcomputer, and Data Rewriting Method
Power Supply Circuit with Control Switches to Voltage Multiplier Having Same Frequency as Clock
Information Processing Apparatus Having an Access Protection Function and Method of Controlling Access to the Information Processing Apparatus
Wireless Communication System, Wireless Communication Apparatus, and Method of Exchanging Cryptography Key Between Wireless Communication Apparatuses
Semiconductor Device Having Heat Spreader with Center Opening
Current to Voltage Converter and Current to Voltage Conversion Method
Radio Receiver, Signal Processing Method and Program Product
High Frequency Amplifier Configuration for Improved Feedback Capacitance Neutralization
Semiconductor device and operation control method of semiconductor device
Application:
11/808,675 →
Publication:
US 2008/0028104
Semiconductor manufacturing apparatus and semiconductor device manufacturing method
Application:
11/808,859 →
Publication:
US 2007/0293032
Switch Element Driver Circuit and Semiconductor Device
Semiconductor Memory Device and Method of Operating the Semiconductor Memory Device
Data Processing Apparatus and Data Processing Method Including Dividing Data to Be Processed
Semiconductor Device
Nonvolatile semiconductor memory with backing wirings and manufacturing method thereof
Application:
11/812,325 →
Publication:
US 2007/0296021
Band-Pass Filter Circuit
Semiconductor Device Capable of Adjusting Output Impedance of External Semiconductor Device and Output Impedance Adjusting Method
Display Control Method and Apparatus
Semiconductor Device Having Superjunction Structure and Method for Manufacturing the Same
Non-Volatile Semiconductor Storage Device and Word Line Drive Method
Switch Coupled Function Blocks with Additional Direct Coupling and Internal Data Passing from Input to Output to Facilitate More Switched Inputs to Second Block
Image processing circuit, image processing system and method therefor
Application:
11/822,056 →
Publication:
US 2008/0002065
Equipment management system
Application:
11/822,063 →
Publication:
US 2008/0010109
Semiconductor Device Having an Inductor
Method and computer program product for circuit analysis and circuit simulation device
Application:
11/822,133 →
Publication:
US 2008/0010329
Display controller in display device, and method of transferring display data
Application:
11/822,143 →
Publication:
US 2008/0001896
Method of manufacturing semiconductor device
Application:
11/822,218 →
Publication:
US 2008/0014751
Display Data Receiving Circuit and Display Panel Driver Having Changeable Internal Clock and Sychronization Mechanisms
Processor system and processing method for operating system program in processor system
Application:
11/822,235 →
Publication:
US 2008/0010426
Semiconductor device and a manufacturing method thereof
Application:
11/822,236 →
Publication:
US 2008/0006864
Multiprocessor system and access right setting method in the multiprocessor system
Application:
11/822,335 →
Publication:
US 2008/0010643
Heat Treatment Jig and Heat Treatment Jig Set
Wiring Substrate, Semiconductor Device, and Method of Manufacturing the Same
Semiconductor Memory Device and Manufacturing Method Thereof
Bolometer-Type Infrared Imaging Apparatus Including a One or Two Dimensional Sensor Array Semiconductor Device
Semiconductor Memory Device
Semiconductor Device and Protection Circuit
Adaptive Equalizer with Function of Stopping Adaptive Equalization Processing and Receiver
Semiconductor Device Having a Function of Detection Breakages on a Periphery Thereof
Method of Fabricating Semiconductor Device
Method of Fabricating Semiconductor Device, and Plating Apparatus
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device and Semiconductor Wafer and a Method for Manufacturing the Same
Apparatus for Driving a Plurality of Display Units Using Common Driving Circuits
Data Read-Out Circuit in Semiconductor Memory Device and Method of Data Reading in Semiconductor Memory Device
Semiconductor Device and Method of Measuring Sheet Resisitance of Lower Layer Conductive Pattern Thereof
Bit-Plane Decoding Device and Bit-Plane Decoding Method
Application:
11/839,563 →
Publication:
US 2008/0043846
Semiconductor Device Including Multilayer Wiring Board with Power Supply Circuit
Application:
11/839,606 →
Publication:
US 2008/0272829
Semiconductor Device
Application:
11/840,246 →
Publication:
US 2008/0042181
Method of Manufacturing Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Semiconductor Package
Method for Processing Interior of Vapor Phase Deposition Apparatus, Method for Depositing Thin Film and Method for Manufacturing Semiconductor Device
Method of Forming Insulating Film and Method of Manufacturing Semiconductor Device
Semiconductor Device Including Through Electrode and Method of Manufacturing the Same
Method of Manufacturing a Semiconductor Device
Application:
11/842,989 →
Publication:
US 2008/0057727
Optical Transmitter Module for Stabilizing Optical Output Power and Wavelength
Mobile Communication System Using Receiving Apparatus and Power Supply Control Method
Application:
11/843,788 →
Publication:
US 2008/0049816
Apparatus and Method for Soft Decision Viterbi Decoding
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 18, 2007
From: IDE, SHUICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019404/0208 →
Assignment of Assignor's Interest
May 18, 2007
From: IKEUCHI, TORU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019385/0596 →
Assignment of Assignor's Interest
May 18, 2007
From: HASHIMOTO, YOSHIHARU; SHU, TAKAYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019386/0879 →
Assignment of Assignor's Interest
May 20, 2007
From: MIZUTANI, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019388/0250 →
Assignment of Assignor's Interest
May 21, 2007
From: NAKAMURA, HIDEYUKI
To: NEC ELECTRONICS CORPORAITON
Reel/Frame 019393/0040 →
Assignment of Assignor's Interest
May 22, 2007
From: WATANABE, KAZUO; SUGAWARA, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019389/0119 →
Assignment of Assignor's Interest
May 23, 2007
From: UEDA, TAKEHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019387/0196 →
Assignment of Assignor's Interest
May 24, 2007
From: NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019401/0660 →
Assignment of Assignor's Interest
May 24, 2007
From: NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019401/0783 →
Assignment of Assignor's Interest
May 25, 2007
From: USHIJIMA, KOUSEI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019397/0806 →
Assignment of Assignor's Interest
May 25, 2007
From: HORI, TAKAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019398/0918 →
Assignment of Assignor's Interest
May 29, 2007
From: WATARAI, SEIICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019412/0319 →
Assignment of Assignor's Interest
Jun 27, 2007
From: UEDA, TAKEHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019492/0255 →
Assignment of Assignor's Interest
Aug 1, 2007
From: TSUCHIYA, HIDEAKI; YOKOGAWA, SHINJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019627/0921 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →