Semiconductor device and semiconductor package
For delivering supply power evenly into chip, a semiconductor device includes plural power supply pads 17 a and grounding pads 18 a , arranged in alternation in X-direction. The device also includes first upper layer power supply wire 17 b , extending in X-direction and connected to first ends of the power supply pads 17 , a first upper layer grounding wire 18 b , extending in X-direction and connected to second end, opposing first end, of the grounding pads 18 a in X-direction. A second upper layer power supply wire 17 c extending between first upper layer power supply wire 17 b and first upper layer grounding wire 18 b , from the power supply pad 17 a nearly to neighboring grounding pad 18 a , and second upper layer grounding wire 18 c extending between first upper layer power supply wire 17 b and first upper layer grounding wire 18 b , from the grounding pad 18 a nearly to neighboring power supply pad 17 a . The pads or wires 17 a , 17 b , 17 c , 18 a , 18 b and 18 c are formed on the same pad layer.
1. A semiconductor device comprising:
a plurality of pads and a plurality of protuberantly formed electrodes arrayed in regular order on a surface of each pad, said semiconductor device being mounted on a wiring board in accordance with a flipchip system;
wherein said semiconductor device comprises:
a plurality of first potential pads to which a first potential is applied;
a plurality of second potential pads to which a second potential different from the first potential is applied; the second potential pads being formed in the same layer as the first potential pads and arrayed in one direction in alternation with the first potential pads;
a first potential upper layer common wire formed in the same layer as the first potential pads; said first potential upper layer common wire extending in said one direction and being connected to a first end of each of the first potential pads viewed in said one direction;
a second potential upper layer common wire formed in the same layer as the second potential pads; said second potential upper layer common wire extending in said one direction and being connected to a second end of the second potential pad said second end being on an opposite side to said first end viewed in said one direction;
a first potential upper layer branched wire formed in the same layer as the first potential pad and extending between said first potential upper layer common wire and said second potential upper layer common wire, from the first potential pad to the vicinity of the second potential pad neighboring the first potential pad; and
a second potential upper layer branched wire formed in the same layer as the second potential pad and extending between said first potential upper layer common wire and said second potential upper layer common wire, from the second potential pad to the vicinity of the first potential pad neighboring to the second potential pad.
2. The semiconductor device according to claim 1 , wherein said first potential upper layer branched wire is arranged between said second potential upper layer common wire and said second potential upper layer branched wire; and wherein
said second potential upper layer branched wire is arranged between said first potential upper layer common wire and said first potential upper layer branched wire.
3. The semiconductor device according to claim 1 , wherein said first potential upper layer branched wire and said second potential upper layer branched wire are branched into a plurality of wires from one side of one of said pads; and wherein
said first potential upper layer branched wires and said second potential upper layer branched wires are interdigitated.
4. The semiconductor device according to claim 1 , further comprising:
a first potential lower layer wire formed in a layer below the first potential pad, said first potential upper layer common wire and said first potential upper layer branched wire; said first potential lower layer wire being connected by way of vias to one or more or all of the first potential pad, said first potential upper layer common wire and said first potential upper layer branched wire; said first potential lower layer wire extending in a direction substantially orthogonal to said first potential upper layer common wire and said first potential upper layer branched wire; and
a second potential lower layer wire formed in a layer below the second potential pad, said second potential upper layer common wire and said second potential upper layer branched wire; said second potential lower layer wire being connected by way of vias to one or more or all of the second potential pad, said second potential upper layer common wire and said second potential upper layer branched wire; said second potential lower layer wire extending in a direction substantially orthogonal to said second potential upper layer common wire and said second potential upper layer branched wire.
5. The semiconductor device according to claim 4 , wherein
said first potential lower layer wire is connected by way of vias to the first potential pad of an n'th row, to said first potential upper layer common wire and said first potential upper layer branched wire of an (n+1)st row, to said first potential upper layer common wire of an (n+2)nd row and to said first potential upper layer common wire and said first potential upper layer branched wire of an (n+3)rd row; and wherein
said second potential lower layer wire is connected by way of vias to said second potential upper layer common wire of an n'th row, to said second potential upper layer common wire and said second potential upper layer branched wire of an (n+1)st row, to the second potential pad of an (n+2)nd row and to said second potential upper layer common wire and said second potential upper layer branched wire of an (n+3)rd row.
6. The semiconductor device according to claim 4 , wherein
said first potential lower layer wire is connected, in an m'th column, by way of vias, to the first potential pad of an n'th row and to said first potential upper layer common wire and said first potential upper layer branched wire of said (n+1)st row; and wherein
said second potential lower layer wire is connected, in said m'th column, by way of vias, to said second potential upper layer common wire of an n'th row and to said second potential upper layer common wire and said second potential upper layer branched wire of said (n+1)st row.
7. The semiconductor device according to claim 6 , wherein
said first potential lower layer wire is connected, in said (m+2)nd column, by way of vias, to said first potential upper layer common wire of said n'th row and to said first potential upper layer common wire and said first potential upper layer branched wire of said (n+1)st row; and wherein
said second potential lower layer wire is connected, in said (m+2)nd column, by way of vias, to said second potential pad of said n'th row and to said second potential upper layer common wire and said second potential upper layer branched wire of said (n+1)st row.
8. The semiconductor device according to claim 1 , wherein
said first potential comprises a power supply potential; and wherein
said second potential comprises a grounding potential.
9. A semiconductor package comprising;
a wire board; and
a semiconductor device according to claim 1 , mounted via electrodes on said wire board in accordance with a flipchip system.