Semiconductor device
A semiconductor device 1 includes a semiconductor chip 10 . Each of the semiconductor chips 10 includes a semiconductor substrate 12 , a semiconductor layer 14 and an interconnect layer 16 . The semiconductor substrate 12 has a specific resistance ρ 1 (first specific resistance). A semiconductor layer 14 is provided on the semiconductor substrate 12 . Such semiconductor layer 14 exhibits a specific resistance ρ 2 (second specific resistance). The relationship of these specific resistances is: ρ 2<ρ1 . The interconnect layer 16 is provided on the semiconductor layer 14 . An inductor 18 for transmitting and receiving signals with an external element outside the semiconductor chip 10 is provided in the interconnect layer 16.
1. A semiconductor device, comprising:
a semiconductor chip, said semiconductor chip comprised of
a semiconductor substrate having a first specific resistance,
a semiconductor layer provided on said semiconductor substrate and having a second specific resistance, said second specific resistance being lower than said first specific resistance,
an interconnect layer provided on said semiconductor layer provided with an inductor in said interconnect layer for transmitting or receiving a signal between the semiconductor chip and an external element, and
a signal processing circuit formed in said semiconductor layer for processing said signal transmitted or received by said inductor.
2. The semiconductor device as set forth in claim 1 , wherein said inductor is configured of interconnects in said interconnect layer, said interconnects being formed to have a coil-shape.
3. The semiconductor device as set forth in claim 1 , wherein an integrated circuit having said signal processing circuit is formed in said semiconductor layer.
4. The semiconductor device as set forth in claim 1 , wherein said semiconductor layer is an epitaxial layer.
5. The semiconductor device as set forth in claim 1 , wherein said second specific resistance is within a range of from 5 Ωcm to 100 Ωcm.
6. The semiconductor device as set forth in claim 1 , wherein said first specific resistance is equal to or higher than 200 Ωcm.
7. The semiconductor device as set forth in claim 6 , wherein said first specific resistance is equal to or higher than 500 Ωcm.
8. The semiconductor device as set forth in claim 1 , further comprising:
a printed circuit board having said semiconductor chip mounted thereon,
wherein an interconnect of said printed circuit board is positioned such that no portion of the interconnect is directly in line with said inductor of said semiconductor chip in a vertical direction.
9. The semiconductor device as set forth in claim 8 ,
wherein said semiconductor chip is flip-chip mounted to said printed circuit board through a bump, and
wherein said bump is positioned such that no portion of said bump is directly in line with said inductor of said semiconductor chip in a vertical direction.
10. The semiconductor device as set forth in claim 9 , further comprising:
a first pad and a second pad, each of said first and second pads being provided on both of said semiconductor chip and said printed circuit board,
wherein said bump interposes between said first and said second pads, and
wherein said first and said second pads are each positioned such that no portion of either of said first and second pads are directly in line with said inductor chip in a vertical direction.
11. A semiconductor device, comprising:
a plurality of semiconductor chips, each of said semiconductor chips comprised of
a semiconductor substrate having a first specific resistance,
a semiconductor layer provided on said semiconductor substrate and having a second specific resistance, said second specific resistance being lower than said first specific resistance, and
an interconnect layer provided on said semiconductor layer provided with an inductor in said interconnect layer for transmitting or receiving a signal between the semiconductor chip and an external element,
wherein the inductors of said semiconductor chips are inductively coupled.
12. The semiconductor device as set forth in claim 11 , wherein said inductor is configured of interconnects in said interconnect layer, said interconnects being formed to have a coil-shape.
13. The semiconductor device as set forth in claim 11 , wherein said semiconductor layer is an epitaxial layer.
14. The semiconductor device as set forth in claim 11 , further comprising:
a printed circuit board having said semiconductor chip mounted thereon,
wherein an interconnect of said printed circuit board is positioned such that no portion of the interconnect is directly in line with said inductor of said semiconductor chip in a vertical direction.
15. The semiconductor device as set forth in claim 14 ,
wherein said semiconductor chip is flip-chip mounted to said printed circuit board through a bump, and
wherein said bump is positioned such that no portion of said bump is directly in line with said inductor of said semiconductor chip in a vertical direction.
16. The semiconductor device as set forth in claim 15 , further comprising:
a first pad and a second pad, each of said first and second pads being provided on both of said semiconductor chip and said printed circuit board,
wherein said bump interposes between said first and said second pads, and
wherein said first and said second pads are each positioned such that no portion of either of said first and second pads are directly in line with said inductor chip in a vertical direction.
17. A semiconductor device, comprising:
a semiconductor chip, the semiconductor chip comprised of
a semiconductor substrate having a first specific resistance,
a semiconductor layer provided on said semiconductor substrate and having a second specific resistance, said second specific resistance being lower than said first specific resistance,
an interconnect layer provided on said semiconductor layer provided with an inductor in said interconnect layer for transmitting or receiving a signal between the semiconductor chip and an external element; and
a printed circuit board having said semiconductor chip mounted thereon,
wherein an interconnect of said printed circuit board is positioned such that no portion of the interconnect is directly in line with said inductor of said semiconductor chip in a vertical direction.
18. The semiconductor device as set forth in claim 17 , wherein said inductor is configured of interconnects in said interconnect layer, said interconnects being formed to have a coil-shape.
19. The semiconductor device as set forth in claim 17 ,
wherein said semiconductor chip is flip-chip mounted to said printed circuit board through a bump, and
wherein said bump is positioned such that no portion of said bump is directly in line with said inductor of said semiconductor chip in a vertical direction.
20. The semiconductor device as set forth in claim 19 , further comprising:
a first pad and a second pad, each of said first and second pads being provided on both of said semiconductor chip and said printed circuit board,
wherein said bump interposes between said first and said second pads, and
wherein said first and said second pads are each positioned such that no portion of either of said first and second pads are directly in line with said inductor chip in a vertical direction.